Panel Level Packaging Form, Panel Level Packaging Chip and Panel Level Packaging Product Structure

                
310*320mm Panel Size Panel Level QFN Low Electrical Resistance

0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter

Panel Level Packaging Panel Level SiP Used In Various Industries

310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption

LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm

310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）

310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon）

Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability

Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump

Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball

Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package

310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product

Company Introduction

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Account Registered in: 2024

Last Login Date: May 03, 2026

Business Type:: Manufacturer

Number of Employees:: 101~120

Year of Establishment:: 2018

Main Markets:: Worldwide

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