Package Suitable For Various Packaging Simulation Experiments

Description:

1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation.

2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized.

3. Key process feasibility simulation analysis from wafer level to package level.

4. Package reliability simulation verification under external load environment such as heat and force.

Competitive Advantage:

1. Verify the process model and electrical and mechanical model

2. Using the model to predict the behavior of the product under the actual environment

Package Suitable For Various Packaging Simulation Experiments Images